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About Me

My name is Nicholas Martin, and welcome to my website! Please take a look around with the navigation bar above.

I am passionate about many areas of engineering, having worked across materials science, defense manufacturing, semiconductors, and medical equipment. I also pursue high-power rocketry; at Tufts, I led the Mechanical Team for our successful entry in the 2024 Spaceport America Cup, and I hold a Level 2 certification from the National Association of Rocketry.

Since graduating from Tufts University with a Bachelor’s in Mechanical Engineering, I have committed to the University of Michigan for my Master’s in Aerospace Engineering. I am seeking Summer 2026 engineering internship opportunities as well as full-time roles after I graduate in December 2026.

Please connect with me on LinkedIn or email me here:

LinkedIn
nickhsmartin@gmail.com

Education

Tufts University (Sept. 2020 – May 2024)
B.S. Mechanical Engineering
GPA: 3.65/4.00

Relevant Coursework:
Thermal Fluid Transport I & II, High Reynolds Number Flow, Mechanics I & II, Materials and Manufacturing I & II, Engineering Design I & II, Composite Materials, Numerical Methods

University of Michigan (Expected Aug. 2025 – Dec. 2026)
M.S. Aerospace Engineering
GPA: x.xx/4.00

Relevant Coursework:

Work Experience


July 2024 – March 2025

Radiation Monitoring Devices, Inc.

Laboratory Technician

After graduating from Tufts, I provided engineering and lab support for RMD’s Advanced Thin Film department, programming instruments, designing systems in CAD, and running simulations. The group conducts SBIR research (primarily DoD & DoE contracts) on the growth and applications of films via chemical and physical vapor deposition.

January 2024 – June 2024

Microwave Engineering Corp.

Mechanical Engineering Intern

At MEC, I assisted in the manufacture of microwave components for defense and aerospace applications. As part of a small four-person team, I wore many hats, revising CAD models, creating engineering drawings and G-code, documenting manufacturing processes, and researching federal requirements.

May 2023 – August 2023

Allegro Microsystems

Package Engineering Intern

For my junior summer, I interned at Allegro as part of the Package Engineering department. While there, I developed and supported Hall effect sensors, gate drivers, capacitors, and other semiconductor products. This was done via thermal and structural simulations coupled with physical testing using Instron and Siemens equipment.

May 2022 – August 2022

Werfen North America

Mechanical Engineering Intern

My first college internship was at Werfen, where I assisted in the research and development of novel automated systems for performing blood diagnostics at labs and hospitals. This involved troubleshooting lifecycle testing and processing the test data in Python, and developing iterative improvements on prototypes.